- All sections
- B - Performing operations; transporting
- B24B - Machines, devices, or processes for grinding or polishing; dressing or conditioning of abrading surfaces; feeding of grinding, polishing, or lapping agents
- B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Patent holdings for IPC class B24B 53/017
Total number of patents in this class: 425
10-year publication summary
50
|
36
|
29
|
51
|
44
|
46
|
39
|
50
|
54
|
15
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Ebara Corporation | 1951 |
68 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
67 |
Applied Materials, Inc. | 16587 |
65 |
Samsung Electronics Co., Ltd. | 131630 |
14 |
Entegris, Inc. | 1736 |
12 |
Kinik Company | 44 |
12 |
Rohm and Haas Electronic Materials CMP Holdings, Inc. | 309 |
11 |
3m Innovative Properties Company | 18406 |
10 |
Shin-Etsu Handotai Co., Ltd. | 1277 |
10 |
Kioxia Corporation | 9847 |
7 |
Seagate Technology LLC | 4228 |
6 |
Dow Global Technologies LLC | 10147 |
6 |
Disco Corporation | 1745 |
5 |
Ehwa Diamond Industrial Co., Ltd. | 64 |
5 |
Tokyo Electron Limited | 11599 |
4 |
Fujikoshi Machinery Corp. | 54 |
4 |
Semiconductor Manufacturing International (Shanghai) Corporation | 1764 |
4 |
Sumco Corporation | 1116 |
4 |
SK Siltron Co., Ltd. | 146 |
4 |
Saesol Diamond Ind. Co., Ltd. | 8 |
4 |
Other owners | 103 |